新产品

F-713.Hxx Compact, High-Speed 6-DoF Photonics Alignment Systems

Single-Sided and Double-Sided, Upright and Low-Profile, Fully Automated Array Alignment Routines

  • Integrated scan/align routines for SiPh wafers, photonic devices, PICs, and fiber optics
  • Powerful array alignment algorithms
  • Fast, simultaneous optimization across multiple devices, I/Os, and degrees of freedom (DOF)
  • Broad and deep software support for rapid process development, including support for popular languages such as C#, Python, LabVIEW, and MATLAB on Windows and Linux
  • Automatic alignment in typically <0.5 s
  • Responsive application and product support from PI worldwide
F-713.Hxx Compact, High-Speed 6-DoF Photonics Alignment Systems
产品描述 规格 下载 报价/订购

Problem solved

PI's Fast Multichannel Photonics Alignment (FMPA) solutions combine application-optimized, fab-ready, highly dynamic alignment stages with sophisticated controllers that integrate the world's most advanced and effective first-light search, profile, and power optimization alignment algorithms.

Reduction of alignment time by 99%

This award-winning technology addresses the number one cost driver for photonics test and assembly: the precise alignment required for each element and channel. Legacy alignment technologies date back to the 1980s and can take minutes to complete. PI's fast optical alignment solutions reduce the time required by typically 99%, routinely completing the task in less than one second. Studies show that up to 80% of the cost of a photonic device is attributable to alignment, without FMPA. If this 80% share of costs is reduced by 99%, the benefits to the manufacturing industry are obvious. And with projections of three orders of magnitude escalation in demand for photonic components in the near future, as new applications and devices emerge, FMPA is a true enabler.

Versatile, compact, proven solutions for 6-DoF alignment challenges

These integrated solutions combine PI's premier compact hexapod with a highly dynamic, ultra-resolution NanoCube® fast piezo scanning stage to provide 6-DOF positioning, scanning, and optimization. Since their introduction in 2016, these unique microrobotic solutions have enabled a variety of applications ranging from silicon photonics wafer probing to array alignment and automated photonics device assembly. They are the solution of choice for many leading OEMs and in-house integration teams. The applications are complex, but the reasons for the choice are simple: groundbreaking alignment speed that improves production throughput by two orders of magnitude, an easy-to-master command set complemented by broad and deep software support, and global application expertise and support.

Synergies for higher performance

The combined hexapod and NanoCube® mechanisms operate synergistically to enable simultaneous optimization across multiple channels, I/Os, and DoF, with parallel optimization across all DoF and I/Os. For example, the NanoCube® offers extreme speed and long life through flexure guides and PICMA piezo drives, while the hexapod offers generous travel that includes pitch-yaw-roll positioning and alignment optimization important for arrayed waveguides, etc. High-resolution analog inputs provide connectivity to power measurement devices, such as PI’s F-712.PM1 high-bandwidth optical power meter, for optimization and profiling, enabling efficient and fast automated fiber optical alignment. Soft limits are supported to ensure process safety.

Low profi le and upright configurations

PI’s 6-DoF fiber alignment systems include the F-713.HA1, F-713.HA2, and F-713.HU1 standard configurations.

The F-713.HA1 and F-713.HA2 single-sided and double-sided angled configurations offer a low profile. This means that the alignment can be performed close to (or even under) the mounting surface thanks to the hexapod’s angled mounting. Ideal for silicon photonics wafer probing applications.

The F-713.HU1 single-sided upright configuration is ideal for device characterization and packaging processes. Upright configurations for two or even more sides are available on request.

Starting with these sophisticated platforms, it is easy to configure further alignment solutions of unprecedented speed that support functionalities such as submicron-sensitive wafer proximity automation.

Application fields

PIC production, alignment of fiber arrays, collimators, optical components or lenses, silicon photonics wafer probing, testing, assembly, and packaging of photonics and fiber optics

Specifications

数据表

Datasheet F-713.Hxx

版本/日期
2025-09-26
pdf - 1 MB
版本/日期
2025-09-26
pdf - 2 MB

Downloads

数据表

数据表

Datasheet F-713.Hxx

版本/日期
2025-09-26
pdf - 1 MB
版本/日期
2025-09-26
pdf - 2 MB

3D模型

3D模型

F-713.Hxx 3D Model

zip - 5 MB

Ask for a free quote on quantities required, prices, and lead times or describe your desired modification.

F-713.HA1 新产品!

Single-sided photonics alignment system consisting of H-811 hexapod and NanoCube® nanopositioner; E-713 digital controller with 4 analog inputs; C-887 hexapod controller with 2 analog inputs; firmware routines for high-speed alignment tasks; software package

F-713.HA2 新产品!

Double-sided photonics alignment system consisting of 2 H-811 hexapods and 2 NanoCube® nanopositioners; E-713 digital controller with 4 analog inputs; 2 C-887 hexapod controllers each with 2 analog inputs; firmware routines for high-speed alignment tasks; software package

F-713.HU1 新产品!

Single-sided photonics alignment system consisting of H-811 hexapod and NanoCube® nanopositioner, upright configuration; E-713 digital controller with 4 analog inputs; C-887 hexapod controller with 2 analog inputs; firmware routines for high-speed alignment tasks; software package

如何获取报价

点击“报价/订购”
将产品类型添加到报价列表
填写报价单
向PI发送报价需求
我们会尽快与您联系

询问工程师

通过电子邮件或电话从当地PI销售工程师处快速获取解答。

Compatible Electronics Related Products Services