F-712.Hxx Compact, High-Speed 6-DOF Photonics Alignment Systems
Single-Sided and Double-Sided, Upright and Low-Profile, Fully Automated Array Alignment Routines
- Integrated scan/align routines for SiPh wafers, photonic devices, PICs, and fiber optics
- Powerful array alignment algorithms
- Fast, simultaneous optimization across multiple devices, I/Os, and degrees of freedom (DoF)
- Broad and deep software support for rapid process development, including support for popular languages such as C#, Python, LabVIEW, and MATLAB on Windows and Linux
- Automatic alignment in typically < 0.5 s
- Responsive application and product support from PI worldwide
Problem solved
PI's Fast Multi-Channel Photonics Alignment (FMPA) solutions combine application-optimized, fab-ready, highly dynamic alignment stages with sophisticated controllers that integrate the world's most advanced and effective first-light search, profile, and power optimization alignment algorithms.
Reduction of alignment time by 99 %
This award-winning technology addresses the number one cost driver for photonics test and assembly: the precise alignment required for each element and channel. Legacy alignment technologies date back to the 1980s and can take minutes to complete. PI's fast optical alignment solutions reduce the time required by typically 99 %, routinely completing the task in less than one second. With studies indicating that on the order of 80 % of the cost of a photonic device is consumed in the alignment prior to FMPA, it is easy to see how profound the production economics benefit from reducing that 80 % by 99 %. And with projections of three orders of magnitude escalation in demand for photonic components in the near future, as new applications and devices emerge, FMPA is a true enabler.
Versatile, compact, proven solutions for 6-DoF alignment challenges
These integrated solutions combine PI's premier compact hexapod with a highly dynamic, ultra-resolution NanoCube® fast piezo scanning stage to provide 6-DoF positioning, scanning, and optimization. Since their introduction in 2016, these unique microrobotic solutions have enabled a variety of applications ranging from silicon photonics wafer probing to array alignment and automated photonics device assembly and are the first choice of many elite OEMs and in-house integration teams. The applications are complex, but the reasons for the choice are simple: groundbreaking alignment speed that improves production throughput by two orders of magnitude, an easy-to-master command set complemented by broad and deep software support, and global application expertise and support.
Synergies for higher performance
The combined hexapod and NanoCube® mechanisms operate synergistically to enable simultaneous optimization across multiple channels, I/Os, and DoF, with parallel optimization across all DoF and I/Os. For example, the NanoCube® offers extreme speed and long life through flexure guides and PICMA piezo drives, while the hexapod offers generous travel that includes pitch-yaw-roll positioning and alignment optimization important for arrayed waveguides, etc. High-resolution analog inputs provide connectivity to power measurement devices, such as PI’s F-712.PM1 high-bandwidth optical power meter, for optimization and profiling, enabling efficient and fast automated fiber optical alignment. Soft limits are supported to ensure process safety.
Low profile and upright configurations
PI’s 6-DOF fiber alignment systems include the F-712.HA1, F-712.HA2, and F-712.HU1 standard configurations.
The F-712.HA1 and F-712.HA2 single-sided and double-sided angled configurations offer a low profile. This means that the alignment can be performed close to (or even under) the mounting surface thanks to the hexapod’s angled mounting. Ideal for silicon photonics wafer probing applications.
The F-712.HU1 single-sided upright configuration is ideal for device characterization and packaging processes. Upright configurations for two or even more sides are available on request.
Starting with these sophisticated platforms, it is easy to configure further alignment solutions of unprecedented speed that support functionalities such as submicron-sensitive wafer proximity automation.
Application fields
PIC production, alignment of fiber arrays, collimators, optical components or lenses, silicon photonics wafer probing, testing, assembly, and packaging of photonics and fiber optics
Specifications
Motion and positioning | F-712.HA1 | F-712.HA2 | F-712.HU1 | Unit |
---|---|---|---|---|
Number of active axes | 9 | 18 | 9 | |
Rough positioning | ||||
Active axes | X, Y, Z, θX, θY, θZ | |||
Travel range in X, Y, Z | ±6,5, ±16, ±8,5 | ±17, ±16, ±6,5 | mm | |
Travel range in θX, θY, θZ | ±14,5, ±10, ±10 | ±10, ±10, ±21 | ° | |
Minimum incremental motion in X, Y | 0.1 | µm | ||
Minimum incremental motion in Z | 0.1 | 0.05 | ||
Max. velocity | 10 | mm/s | ||
Sensor type | Incremental rotary encoder | |||
Drive type | Brushless DC motor | |||
Fine positioning | ||||
Active axes | X, Y, Z | |||
Travel range in X, Y, Z, closed loop | 100 | µm | ||
Min. incremental motion, open-loop | 0.3 | nm | ||
Min. incremental motion, closed-loop | 2.5 | nm | ||
Linearity error, for the entire travel range* | 2 | % | ||
Repeatability (bidirectional) 10% travel range | 2 | nm | ||
Sensor type | Incremental linear encoder | |||
Drive type | PICMA® | |||
Alignment | ||||
Scanning time of spiraled area scan 500 µm Ø** | < 2 | < 5 | < 2 | s |
Scanning time of spiraled area scan 100 µm Ø** | < 0.3 | < 1 | < 0.3 | s |
Scanning time of spiraled area scan 10 µm Ø** | < 0.2 | < 0.5 | < 0.2 | s |
Signal optimization with gradient search, randomized with ±5 µm (repeatability < 0.01 dB)*** | < 0.3 | s |
The maximum travel ranges of the individual coordinates (X, Y, Z, θX, θY, θZ) are interdependent. The data for each axis shows its maximum travel range when all other axes are in the zero position of the nominal travel range and the default coordinate system is in use, or rather when the pivot point is set to 0,0,0.
Downloads
产品注解
文件
UserManualF712T0024
F-712.HP1 Mounting Adapter for F-712.HA1 / F-712.HA2 Fiber Alignment Systems
用户使用手册F603T0003
用于P-616类型(NanoCube)压电定位器的F-603.41 / F-603.42 / F-603.43纤维支架
用户使用手册F712T0003
用于快速多通道光子学对准的六自由度F-712.HA1和F-712.HA2系统。硬件描述。
用户使用手册E712T0016
快速多通道光子学对准。用于硅光子学生产中的快速光学对准的硬件和固件。
用户使用手册F712T0019
光功率的计算 - 使用F-712.PM1功率计和F-712高精度光纤对准系统
User Manual F712T0007
F-712.HU1 High-Precision Fiber Alignment System
3D模型
F-712.HA 3-D模型
Quote / Order
Ask for a free quote on quantities required, prices, and lead times or describe your desired modification.
询问工程师
通过电子邮件或电话从当地PI销售工程师处快速获取解答。
技术
主动对准
在众多领域中,兴起了将器件对准至纳米级精度的需求。诸如小型照相机中的镜头或镜头组件等光学部件乃至CCD芯片自身,均需要以更高的精度进行定位。
PI产品的EtherCAT连接性
PI提供高精度驱动器,其可用作EtherCAT从控制器,或与ACS运动控制器集成后用作主控制器,或在现有结构中用作第二主控制器。
数字运动控制器
数字技术为提高不存在于传统模拟技术的控制工程的性能开辟了可能性。
数字和模拟接口
高速USB或TCP/IP接口以及RS-232是PI现代数字控制器支持的标准接口。此外,PI也提供数字或模拟实时能力接口。
多轴定位器
六足位移台平台适用于在所有六个自由度(即三根线性轴和三根旋转轴)实现负载的准确定位和校准。